OVERALL COURSE OBJECTIVE:
This course aims to equip students with the fundamental knowledge and practical skills necessary to design and layout single and double-layer printed circuit boards (PCBs) using Orcad/Cadence EDA software.
LEARNING OUTCOMES:
Upon successful completion of this course, students will be able to:
• List the types and applications of PCBs in various industries.
• Identify common electronic components and their packaging types.
• Apply the PCB design workflow from schematic capture to
fabrication and assembly.
• Apply design rules and standards for single and double-layer PCBs.
• Use Orcad tools effectively for schematic capture, PCB layout design, and footprint creation.
• Design and implement any microcontroller-based circuit using Orcad.
• Employ optimal component placement strategies considering heat dissipation, signal integrity, and manufacturability.
• Implement proper routing techniques for single and double-layer PCBs, adhering to design rules and signal integrity considerations.
• Identify the problems while designing the PCB and troubleshoot them.
• Generate Gerber files for PCB manufacturing.
• Apply best practices in PCB design, including design for manufacturability (DFM),
thermal management, and documentation practices.
• Design and layout a single or double-layer PCB for a specific electronic project using the acquired knowledge and Orcad tools.
• Create comprehensive PCB design documentation, including schematics, layout files,and bill of materials (BOM)